• Pd Charger RoHS Perfect Replacement for The Gallium Nitride (GaN) Device in High-Frequency Operations Super Si Mosfet
  • Pd Charger RoHS Perfect Replacement for The Gallium Nitride (GaN) Device in High-Frequency Operations Super Si Mosfet
  • Pd Charger RoHS Perfect Replacement for The Gallium Nitride (GaN) Device in High-Frequency Operations Super Si Mosfet
  • Pd Charger RoHS Perfect Replacement for The Gallium Nitride (GaN) Device in High-Frequency Operations Super Si Mosfet
  • Pd Charger RoHS Perfect Replacement for The Gallium Nitride (GaN) Device in High-Frequency Operations Super Si Mosfet
  • Pd Charger RoHS Perfect Replacement for The Gallium Nitride (GaN) Device in High-Frequency Operations Super Si Mosfet

Pd Charger RoHS Perfect Replacement for The Gallium Nitride (GaN) Device in High-Frequency Operations Super Si Mosfet

certificaat: RoHS, ISO
Vorm: Metal Porcelain Tube
afscherming Type: Sharp Cutoff Afscherming Tube
koelmethode: Luchtgekoeld Tube
Functie: switch Transistor
werken Frequency: Hoge frequentie

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  • Overzicht
  • Product Description
Overzicht

Basis Informatie.

Model NR.
OSS65R340DF TO252
Structuur
Planar
inkapseling Structuur
Plastic Sealed Transistor
Kracht niveau
medium Vermogen
Materiaal
Silicium
beschrijving
extreem laag schakelverlies
kenmerken
uitstekende stabiliteit en uniformiteit
toepassingen
pc-voeding
industrieën
led-verlichting
Transportpakket
Carton
Specificatie
37*37*29CM
Handelsmerk
Orientalsemiconductor
Oorsprong
China
Gs-Code
854129000
Productiecapaciteit
20K/Monthly

Beschrijving

Product Description

General Description

The GreenMOS® high voltage MOSFET utilizes charge balance technology to achieve outstanding low on-resistance and lower gate charge. It is engineered to minimize conduction loss, provide superior switching performance and robust avalanche capability.
The GreenMOS® SuperSi series is based on Oriental Semiconductor's unique device design to achieve extremely fast switching characteristics. It is the perfect replacement for the Gallium Nitride (GaN) device in high frequency operations with better ruggedness and cost. It is targeted to meet the most aggressive efficiency standards of power supply systems by pushing both performance and power density to extreme limits.

Features                                                                                                  
  • Low RDS(ON) & FOM
  • Extremely low switching loss
  • Excellent stability and uniformity
  • Easy to design in

Applications
  • PD charger
  • Large screen display
  • Telecom power
  • Server power


Key Performance Parameters

 
Parameter Value Unit
VDS, min @ Tj(max) 700 V
ID, pulse 36 A
RDS(ON), max @ VGS=10V 340
Qg 9.6 nC

Marking Information

 
Product Name Package Marking
OSS65R340DF TO252 OSS65R340D

Package & Pin Information
 
       
       
 

 
 
Absolute Maximum Ratings at Tj=25°C unless otherwise noted
 
Parameter Symbol Value Unit
Drain-source voltage VDS 650 V
Gate-source voltage VGS ±30 V
Continuous drain current1), TC=25 °C
ID
12
A
Continuous drain current1), TC=100 °C 7.6
Pulsed drain current2), TC=25 °C ID, pulse 36 A
Continuous diode forward current1), TC=25 °C IS 12 A
Diode pulsed current2), TC=25 °C IS, pulse 36 A
Power dissipation3), TC=25 °C PD 83 W
Single pulsed avalanche energy5) EAS 200 mJ
MOSFET dv/dt ruggedness, VDS=0…480 V dv/dt 50 V/ns
Reverse diode dv/dt, VDS=0…480 V, ISD≤ID dv/dt 15 V/ns
Operation and storage temperature Tstg, Tj -55 to 150 °C

Thermal Characteristics
 
Parameter Symbol Value Unit
Thermal resistance, junction-case RθJC 1.5 °C/W
Thermal resistance, junction-ambient4) RθJA 62 °C/W

Electrical Characteristics at Tj=25°C unless otherwise specified
Parameter Symbol Min. Typ. Max. Unit Test condition

Drain-source breakdown voltage

BVDSS
650    
V
VGS=0 V, ID=250 μA
700     VGS=0 V, ID=250 μA, Tj=150 °C
Gate threshold voltage VGS(th) 2.9   3.9 V VDS=VGS, ID=250 μA

Drain-source on- state resistance

RDS(ON)
  0.30 0.34
Ω
VGS=10 V, ID=6 A
  0.73   VGS=10 V, ID=6 A, Tj=150 °C
Gate-source leakage current
IGSS
    100
nA
VGS=30 V
    -100 VGS=-30 V
Drain-source leakage current IDSS     1 μA VDS=650 V, VGS=0 V

Dynamic Characteristics
Parameter Symbol Min. Typ. Max. Unit Test condition
Input capacitance Ciss   443.5   pF
VGS=0 V, VDS=50 V, ƒ=100 KHz
Output capacitance Coss   59.6   pF
Reverse transfer capacitance Crss   1.7   pF
Turn-on delay time td(on)   22.4   ns
VGS=10 V, VDS=400 V, RG=2 Ω, ID=6 A
Rise time tr   17.5   ns
Turn-off delay time td(off)   40.3   ns
Fall time tf   7.2   ns

Gate Charge Characteristics
Parameter Symbol Min. Typ. Max. Unit Test condition
Total gate charge Qg   9.6   nC

VGS=10 V, VDS=400 V, ID=6 A
Gate-source charge Qgs   2.2   nC
Gate-drain charge Qgd   4.5   nC
Gate plateau voltage Vplateau   6.5   V

Body Diode Characteristics
Parameter Symbol Min. Typ. Max. Unit Test condition
Diode forward voltage VSD     1.3 V IS=12 A, VGS=0 V
Reverse recovery time trr   236.5   ns
VR=400 V, IS=6 A,
di/dt=100 A/μs
Reverse recovery charge Qrr   2.2   μC
Peak reverse recovery current Irrm   19.1   A

Note
  1. Calculated continuous current based on maximum allowable junction temperature.
  2. Repetitive rating; pulse width limited by max. junction temperature.
  3. Pd is based on max. junction temperature, using junction-case thermal resistance.
  4. The value of RθJA is measured with the device mounted on 1 in 2 FR-4 board with 2oz. Copper, in a still air environment with Ta=25 °C.
  5. VDD=100 V, VGS=10 V, L=60 mH, starting Tj=25 °C.
Pd Charger RoHS Perfect Replacement for The Gallium Nitride (GaN) Device in High-Frequency Operations Super Si Mosfet

 Pd Charger RoHS Perfect Replacement for The Gallium Nitride (GaN) Device in High-Frequency Operations Super Si Mosfet
 
Pd Charger RoHS Perfect Replacement for The Gallium Nitride (GaN) Device in High-Frequency Operations Super Si MosfetPd Charger RoHS Perfect Replacement for The Gallium Nitride (GaN) Device in High-Frequency Operations Super Si MosfetPd Charger RoHS Perfect Replacement for The Gallium Nitride (GaN) Device in High-Frequency Operations Super Si Mosfet




 

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