| CAS No.: | 61788-97-4 |
|---|---|
| Formule: | (C11h12o3)N |
| EINECS: | n.v.t. |
| Bonding Functie: | Bestand tegen hoge temperaturen Adhesive |
| Morfologie: | Solvent |
| Toepassing: | Automobile, Bouw, Houtbewerking, Footwear & Leather, Fiber & Kleding, Verpakking |
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JQ58-F Epoxy Resin For Potting Compound
Product Description
Epoxy resin JQ58-F is a black epoxy potting resin, can be cured under normal temperature and low temperature, with good flowing property, natural defoaming, it can also be cured at high temperature.
Product Details
Properties before Hardening
|
Part |
JQ58-FB |
JQ58-FB |
|
Color |
Black |
Red Black |
|
Specific gravity |
1.65 |
0.96 |
|
Viscosity (25ºC) |
6000-10000CPS |
250CPS MaxCPS |
|
Mixing ratio |
A: B = 100:20(weight ratio) |
|
|
Hardening conditions |
25ºC×8H to 10H or 55ºC×2H(2g) |
|
|
Usable time |
25ºC×40min(100g) |
|
Operation
1.Weigh A and B glue according to the given weight ratio into the prepared cleaned container, fully mixed the mixture again the container wall by clockwise, place it along for 3 to 5 minutes, and then it can be used.
2.Take the glue according to the usable time and dosage of mixture to avoid wasting. When the temperature is below 15 ºC, please heat A glue to 30 ºC first and then mix it to the B glue (A glue will be thicken in low temperature ); The glue must be sealed lid after use to avoid rejection caused by moisture absorption.
3.When the relative humidity is higher than 85%, the surface of the cured mixture will absorb moisture in the air, and form a layer of white mist in the surface, so when the relative humidity is higher than 85%, is not suitable for room temperature curing, suggest to use the heat curing.
Properties after Hardening
|
Hardness, shore D |
<87 |
|
Withstand voltage, KV/mm |
22 |
|
Flexural strength, Kg/mm2 |
23 |
|
Volume resistivity, Ohm3 |
1x1015 |
|
Surface resistance, Ohmm2 |
5X1015 |
|
Thermal conductivity, W/M.K |
0.6 |
|
Induced electric loss, 1KHZ |
0.42 |
|
Withstand high temperature, ºC |
140 |
|
Moisture absorption, % |
<0.15 |
|
Compressive strength, Kg/ mm2 |
11.3 |
Caution
1,The operating environment should be ventilative and should keep away from fire. Closely sealed after use
2, Avoid eye contact, in case of contact, wash with plenty of water and get medical attention immediately.
3, If contact skin, wrap with clean cloth or paper, and wash it with water and soap.
4, Keep away from children.
5, Please take a trial before application to avoid usage mistake.
Storage And Shelf Life
1, Store at the temperature of 25°C or cool and dry place. Avoid from sunlight, high temperature or high humidity environment.
2, Use up as soon as possible when opened. It is strictly forbidden to expose to the air for a long time after it is opened to avoid affecting the quality of the products. The shelf life is six months in the room temperature of 25°C degree.
Notice: The above data is typical data measured by the laboratory environment under
the temperature of 25 ºC, and humidity of 70%. For customers' reference only.
Application: JQ58-F can be widely used for electronics potting, power encapsulation, mold filling and the insulation of other electronic components, moisture proof,confidential encapsulation, etc.
| Packaging | Regular packing, Protect by Pallet |
| Delivery Port | Tianjin |
| Delivery Time | 7-15 working days |
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